James E. Benedict
33Patents
3h-index
36Co-inventors
52Inventor score
Filing activity: Nov 5, 2018 → Jan 18, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10826147B2 | Radio frequency circuit with a multi-layer transmission line assembly having a conductively filled trench surrounding the transmission line | Electricity | 14 | Active |
| US10839992B1 | Thick film resistors having customizable resistances and methods of manufacture | Electricity | 4 | Active |
| US10631405B1 | Additive manufacturing technology (AMT) inverted pad interface | Electricity | 3 | Active |
| US10999938B1 | Method of wire bonding a first and second circuit card | Emerging Cross-Sectional Technologies | 1 | Active |
| US10849219B2 | SNAP-RF interconnections | Electricity | 1 | Active |
| US11121474B2 | Additive manufacturing technology (AMT) low profile radiator | Performing Operations; Transporting | 1 | Active |
| US11122692B1 | Preparation of solder bump for compatibility with printed electronics and enhanced via reliability | Electricity | 1 | Active |
| US11089687B2 | Additive manufacturing technology (AMT) low profile signal divider | Electricity | 1 | Active |
| US11470725B2 | Method for fabricating Z-axis vertical launch | Electricity | 0 | Active |
| US12266629B2 | Ball bond impedance matching | Electricity | 0 | Active |
| US11569574B2 | Millimeter wave phased array | Electricity | 0 | Active |
| US11109489B2 | Apparatus for fabricating Z-axis vertical launch within a printed circuit board | Electricity | 0 | Active |
| US11171101B2 | Process for removing bond film from cavities in printed circuit boards | Electricity | 0 | Active |
| US11145977B2 | Interlocking modular beamformer | Electricity | 0 | Active |
| US11653484B2 | Printed circuit board automated layup system | Electricity | 0 | Active |
| US11432408B2 | Additive manufactured reactive beamformer | Performing Operations; Transporting | 0 | Active |
| US11317502B2 | PCB cavity mode suppression | Electricity | 0 | Active |
| US11444365B2 | Radio-frequency (RF)-interface and modular plate | Electricity | 0 | Active |
| US11482795B2 | Segmented patch phased array radiator | Electricity | 0 | Active |
| US11375609B2 | Method of manufacturing radio frequency interconnections | Electricity | 0 | Active |
| US11497118B2 | Method for manufacturing non-planar arrays with a single flex-hybrid circuit card | Electricity | 0 | Active |
| US11145952B2 | Advanced communications array | Electricity | 0 | Active |
| US11289814B2 | Spiral antenna and related fabrication techniques | Electricity | 0 | Active |
| US12021306B2 | Low profile phased array | Performing Operations; Transporting | 0 | Active |
| US11107610B2 | Thick film resistors having customizable resistances and methods of manufacture | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.