Heat sink assembly
US10631436B1 · kind B1 · utility
3Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2018 |
| Grant date | Apr 21, 2020 |
| Priority date | — |
| Expiry date | Nov 14, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2049
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat sink assembly, includes: a first heat sink; an adhesive thermal interface material applied to the first heat sink to mate the first heat sink to a first heat-generating component; a second heat sink; one or more support members connecting the first heat sink and the second heat sink; and a non-adhesive thermal interface material applied to the second heat sink to mate the second heat sink to a second heat-generating component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.