Karl Stathakis
26Patents
3h-index
13Co-inventors
52Inventor score
Filing activity: Nov 6, 2014 → Aug 14, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9695829B2 | Variable inlet vanes | Electricity | 4 | Active |
| US9482833B1 | Light pipe connector apparatus | Physics | 4 | Active |
| US9721855B2 | Alignment of three dimensional integrated circuit components | Electricity | 3 | Active |
| USD1015326S1 | Storage device | General | 3 | Active |
| US10631436B1 | Heat sink assembly | Electricity | 3 | Active |
| US9869318B2 | Variable inlet vanes | Electricity | 2 | Active |
| US10319609B2 | Adhesive-bonded thermal interface structures | Electricity | 2 | Active |
| US11089717B2 | Reconfigurable storage thermal dissipation | Electricity | 2 | Active |
| US10749304B1 | Port for heat sink ono active cable end | Electricity | 1 | Active |
| US9850908B2 | Variable inlet vanes | Electricity | 0 | Active |
| US9299686B1 | Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars | Electricity | 0 | Active |
| US10415571B2 | Variable inlet vanes | Electricity | 0 | Active |
| US9508614B2 | Alignment of three dimensional integrated circuit components | Electricity | 0 | Active |
| US10833445B1 | Cable connector housing attachment for protecting and directing a cable | Electricity | 0 | Active |
| US9389379B1 | Dual optical and electrical LGA contact | Electricity | 0 | Active |
| US9414527B2 | Thermal spreading for an externally pluggable electronic module | Electricity | 0 | Active |
| US10607859B2 | Adhesive-bonded thermal interface structures | Electricity | 0 | Active |
| US9299591B1 | Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars | Electricity | 0 | Active |
| US10738903B2 | Microfluidic relief valve | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US9414528B2 | Thermal spreading for an externally pluggable electronic module | Electricity | 0 | Active |
| US10304699B2 | Adhesive-bonded thermal interface structures | Electricity | 0 | Active |
| US9494752B2 | Dual optical and electrical LGA contact | Electricity | 0 | Active |
| US10236189B2 | Adhesive-bonded thermal interface structures for integrated circuit cooling | Electricity | 0 | Active |
| US10288076B2 | Variable inlet vanes | Electricity | 0 | Active |
| US9726837B2 | Light pipe connector apparatus | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.