Patent · US Active

Thermoplastic compositions having good dielectric and ductility properties

US10633537B2 · kind B2 · utility

1Cited by

2References

15Claims

0Family size

Assignee

SABIC GLOBAL TECHNOLOGIES B.V. · NL

Inventors

Jian Wang · Rosharon, US
Wei Shan · Shanghai, CN
Xing Liu · Bergen op Zoom, NL

Key dates

Filing date	Jul 1, 2019
Grant date	Apr 28, 2020
Priority date	—
Expiry date	Jul 1, 2039

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L2205/035
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A thermoplastic composition includes from 29.9 wt % to 84.9 wt % of a base resin including poly(p-phenylene oxide) (PPO), polystyrene (PS) and an impact modifier; from 15 wt % to 70 wt % of a dielectric filler; and from 0.1 wt % to 10 wt % of an impact promoter including a polycarbonate-siloxane copolymer, a polyolefin-siloxane copolymer, or a combination thereof. The thermoplastic composition has a dielectric constant (Dk) of from 3.0-8.0 between 1 and 5 gigahertz (GHz) and a dissipation factor (Df) of less than 0.003 between 1 and 5 GHz. Articles including the thermoplastic composition, and in particular telecommunications devices, are also described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.