Wei Shan
33Patents
9h-index
50Co-inventors
78Inventor score
Filing activity: Apr 23, 2002 → Jun 17, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6713856B2 | Stacked chip package with enhanced thermal conductivity | Electricity | 82 | Expired |
| US7737636B2 | LED assembly with an LED and adjacent lens and method of making same | Electricity | 31 | Active |
| US8927661B2 | Flame retardant polycarbonate compositions, methods of manufacture thereof and articles comprising the same | Chemistry; Metallurgy | 22 | Active |
| US8895649B2 | Flame retardant polycarbonate compositions, methods of manufacture thereof and articles comprising the same | Chemistry; Metallurgy | 21 | Active |
| US6683385B2 | Low profile stack semiconductor package | Electricity | 20 | Expired |
| US6849932B2 | Double-sided thermally enhanced IC chip package | Electricity | 14 | Expired |
| US7569764B2 | Solar modules with tracking and concentrating features | Emerging Cross-Sectional Technologies | 12 | Active |
| US8947619B2 | Photoluminescence color display comprising quantum dots material and a wavelength selective filter that allows passage of excitation radiation and prevents passage of light generated by photoluminescence materials | Physics | 11 | Active |
| US6555919B1 | Low profile stack semiconductor package | Electricity | 11 | Expired |
| US6709894B2 | Semiconductor package and method for fabricating the same | Electricity | 5 | Expired |
| US6857865B2 | Mold structure for package fabrication | Electricity | 5 | Expired |
| US6911604B2 | Bonding pads of printed circuit board capable of holding solder balls securely | Electricity | 4 | Expired |
| US7989701B2 | Multiconductor cable assembly and fabrication method therefor | Electricity | 4 | Active |
| US8115096B2 | Methods and apparatuses for improving power extraction from solar cells | Emerging Cross-Sectional Technologies | 4 | Active |
| US8349644B2 | Mono-silicon solar cells | Emerging Cross-Sectional Technologies | 3 | Active |
| US10820073B2 | Speaker box | Electricity | 2 | Active |
| US8772396B2 | Poly(arylene ether)—polyolefin composition and its use in wire and cable insulation and sheathing | Chemistry; Metallurgy | 2 | Active |
| US11518880B2 | Thermoplastic polycarbonate compositions with improved hydrolytic stability and electrical tracking resistance and shaped articles thereof | Chemistry; Metallurgy | 1 | Active |
| US10633537B2 | Thermoplastic compositions having good dielectric and ductility properties | Chemistry; Metallurgy | 1 | Active |
| US10301472B2 | Poly(etherimide-siloxane)-polyester compositions, method of manufacture, and articles made therefrom | Chemistry; Metallurgy | 0 | Active |
| US10752771B2 | Low dielectric constant (DK) and dissipation factor (DF) material for nano-molding technology (NMT) | Chemistry; Metallurgy | 0 | Active |
| US12126745B2 | Foldable screen device | Electricity | 0 | Active |
| US10301467B2 | Flexible, UV resistant poly(phenylene ether) composition and insulated conductor and jacketed cable comprising it | Chemistry; Metallurgy | 0 | Active |
| US12198050B2 | Artificial intelligence driven identification of application programming interface relationships | Physics | 0 | Active |
| US11104796B2 | Polycarbonate compositions for mobile phone housing applications | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.