Copper plating bath composition and method for deposition of copper

US10633755B2 · kind B2 · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Dirk Rohde · Berlin, DE
• Jens Palm · Berlin, DE

Key dates

• Filing date: Sep 9, 2016
• Grant date: Apr 28, 2020
• Expiry date: Jul 5, 2037

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D7/12
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The present invention relates to aqueous acidic plating baths for copper deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and an additive obtainable by a reaction of at least one aminoglycidyl compound comprising at least one amino group which bears at least one glycidyl moiety and at least one second compound selected from ammonia and amine compounds wherein the amine compounds comprise at least one primary or secondary amino group with the proviso that the aminoglycidyl compound contains at least one polyoxyalkylene residue and/or the amine compound contains at least one polyoxyalkylene residue. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.