Jens Palm
4Patents
1h-index
10Co-inventors
37Inventor score
Filing activity: Sep 9, 2016 → May 10, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11035051B2 | Acidic aqueous composition for electrolytic copper plating | Chemistry; Metallurgy | 1 | Active |
| US10633755B2 | Copper plating bath composition and method for deposition of copper | Chemistry; Metallurgy | 0 | Active |
| US12071702B2 | Acidic aqueous composition for electrolytic copper plating | Chemistry; Metallurgy | 0 | Active |
| US12054843B2 | Acidic aqueous composition for electrolytically depositing a copper deposit | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.