Composite thermistor chip and preparation method thereof
US10636550B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2018 |
| Grant date | Apr 28, 2020 |
| Priority date | — |
| Expiry date | Oct 31, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C17/281
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A composite thermistor chip includes a thermosensitive ceramic chip, a metal electrode and a glass glaze resistor, wherein the thermosensitive ceramic chip has a front side and a back side, the metal electrode includes a first terminal electrode, a second terminal electrode and a third electrode layer; the first terminal electrode and the second terminal electrode are respectively arranged at two ends of the front side of the thermosensitive ceramic chip, and the glass glaze resistor is arranged on the front side of the thermosensitive ceramic chip, two ends of the glass glaze resistor are respectively connected to the first terminal electrode and the second terminal electrode; and the back side of the thermosensitive ceramic chip is covered with the third electrode layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.