Jun Yang
29Patents
14h-index
57Co-inventors
84Inventor score
Filing activity: Aug 23, 2000 → Jul 14, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6730544B1 | Stackable semiconductor package and method for manufacturing same | Electricity | 167 | Expired |
| US7045396B2 | Stackable semiconductor package and method for manufacturing same | Electricity | 141 | Expired |
| US7700411B2 | Semiconductor device package and manufacturing method | Electricity | 72 | Active |
| US7633170B2 | Semiconductor device package and manufacturing method thereof | Electricity | 62 | Expired |
| US6605866B1 | Stackable semiconductor package and method for manufacturing same | Electricity | 44 | Expired |
| US7146011B2 | Steering of directional sound beams | Electricity | 37 | Expired |
| US7656047B2 | Semiconductor device package and manufacturing method | Electricity | 35 | Active |
| US6879034B1 | Semiconductor package including low temperature co-fired ceramic substrate | Electricity | 25 | Expired |
| US7166917B2 | Semiconductor package having passive component disposed between semiconductor device and substrate | Electricity | 21 | Expired |
| US6995448B2 | Semiconductor package including passive elements and method of manufacture | Emerging Cross-Sectional Technologies | 17 | Expired |
| US7439098B2 | Semiconductor package for encapsulating multiple dies and method of manufacturing the same | Electricity | 16 | Expired |
| US9236356B2 | Semiconductor package with grounding and shielding layers | Electricity | 15 | Active |
| US6469258B1 | Circuit board for semiconductor package | Electricity | 14 | Expired |
| US6639308B1 | Near chip size semiconductor package | Electricity | 14 | Expired |
| US7833837B2 | Chip scale package and method for manufacturing the same | Electricity | 9 | Active |
| US7146106B2 | Optic semiconductor module and manufacturing method | Electricity | 8 | Expired |
| US6646290B1 | Optical structure having an optical diode and a sensor in separate apertures inside double insulating layers | Electricity | 4 | Expired |
| US10636550B2 | Composite thermistor chip and preparation method thereof | Electricity | 1 | Active |
| US8625814B2 | Earphone antenna of a portable terminal | Electricity | 1 | Active |
| US11708643B2 | Method and apparatus for manufacturing monocrystalline silicon | Chemistry; Metallurgy | 0 | Active |
| US11742453B2 | Method for manufacturing monocrystalline silicon wafer containing arced side, method for manufacturing monocrystalline silicon cell, and photovoltaic module | Emerging Cross-Sectional Technologies | 0 | Active |
| US11719891B2 | Method of making a lensed connector with photosensitive glass | Physics | 0 | Active |
| US9758673B2 | Polyamide molding compositions, molded parts obtained therefrom, and use thereof | Chemistry; Metallurgy | 0 | Active |
| US10330539B2 | High precision high reliability and quick response thermosensitive chip and manufacturing method thereof | Electricity | 0 | Active |
| US8154111B2 | Near chip size semiconductor package | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.