Substrate processing apparatus and method of manufacturing semiconductor device
US10636681B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2018 |
| Grant date | Apr 28, 2020 |
| Priority date | — |
| Expiry date | Dec 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67201
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus includes a first processing module including a first processing module, a second processing module, a first utility system adjacent to a back surface of the first processing module, and a second utility system adjacent to a back surface of the second processing module, a first exhaust box of the first utility system and a second exhaust box of the second utility system being disposed to face each other across a maintenance area located behind a part of the back surface of the first processing module that is close to the second processing module and behind a part of the back surface of the second processing module that is close to the first processing module, and a first supply box of the first utility system and a second supply box of the second utility system being disposed to face each other across the maintenance area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.