Package structure and the method to fabricate thereof
US10636735B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2011 |
| Grant date | Apr 28, 2020 |
| Priority date | — |
| Expiry date | Jan 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention discloses a package structure made of the combination of a metallic substrate and a lead frame. In one embodiment, a recess is formed in the metallic substrate and a first conductive element having at least one first I/O terminal is bonded in the recess. A lead frame is formed on the metallic substrate and comprises a plurality of electrical connections to connect with said at least one first I/O terminal of the first conductive element. In another embodiment, another conductive element is disposed in the vacancy of the lead frame. The invention also discloses a method for manufacturing a package structure made of the combination of a metallic substrate and a lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.