Jeng-Jen Li
11Patents
2h-index
16Co-inventors
47Inventor score
Filing activity: Jan 10, 2000 → Oct 26, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6383048B1 | Packaging method for organic polymer EL displays | Electricity | 19 | Expired |
| US7405467B2 | Power module package structure | Emerging Cross-Sectional Technologies | 8 | Expired |
| US8253041B2 | Electronic element packaging module | Electricity | 1 | Active |
| US9484290B2 | Electronic system with a composite substrate | Electricity | 1 | Active |
| US8619428B2 | Electronic package structure | Electricity | 1 | Active |
| US9536798B2 | Package structure and the method to fabricate thereof | Emerging Cross-Sectional Technologies | 1 | Active |
| US9386686B2 | Metal core printed circuit board and electronic package structure | Emerging Cross-Sectional Technologies | 0 | Active |
| US10373930B2 | Package structure and the method to fabricate thereof | Electricity | 0 | Active |
| US10373894B2 | Package structure and the method to fabricate thereof | Emerging Cross-Sectional Technologies | 0 | Active |
| US8547709B2 | Electronic system with a composite substrate | Electricity | 0 | Active |
| US10636735B2 | Package structure and the method to fabricate thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.