Patent · US Active

Semiconductor package structure and method for forming the same

US10636773B2 · kind B2 · utility

6Cited by

4References

19Claims

0Family size

Assignee

MEDIATEK INC. · TW

Inventors

Che-Hung Kuo · Hsinchu, TW
Che-Ya Chou

Key dates

Filing date	Jul 6, 2016
Grant date	Apr 28, 2020
Priority date	—
Expiry date	Jul 6, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package structure is provided. The semiconductor package structure includes a first semiconductor die including a first active surface and a first non-active surface. The semiconductor package structure also includes a second semiconductor die including a second active surface and a second non-active surface. The second semiconductor die is stacked on the first semiconductor die. The first non-active surface faces the second non-active surface. The semiconductor package structure further includes a first redistribution layer (RDL) structure. The first active surface faces the first RDL structure. In addition, the semiconductor package structure includes a second RDL structure. The second active surface faces the second RDL structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.