Imaging device and manufacturing method thereof
US10636819B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2019 |
| Grant date | Apr 28, 2020 |
| Priority date | — |
| Expiry date | Jul 10, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/807
Abstract
An imaging device is provided, the imaging device including: a first-conductivity-type substrate; a first-conductivity-type element forming portion provided on the substrate, and having a concentration lower than the substrate; and a plurality of pixel portions provided in the element forming portion, and arrayed two-dimensionally, each pixel portion having a light receiving element, and a second-conductivity-type carrier absorbing portion provided in an area different from an area where the light receiving element is provided. At least one pixel portion of the pixel portions has: a first-conductivity-type first wall portion provided on a substrate side relative to the light receiving element, the first wall portion overlapping at least part of the light receiving element in an array direction of the pixel portions, and having a concentration higher than the substrate, and a carrier passage area not provided with the first wall portion in the array direction of the pixel portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.