Ground member, shielded printed circuit board, and method for manufacturing shielded printed circuit board
US10638598B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2018 |
| Grant date | Apr 28, 2020 |
| Priority date | — |
| Expiry date | Feb 9, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0715
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention aims to provide a ground member that can be mounted on any position, wherein misalignment is less likely to occur between conductive filler particles of the ground member and a shielding layer of a shielding film when a shielded printed wiring board including the ground member is repeatedly heated and cooled to mount components thereon. The ground member of the present invention includes: a conductive external connection member having a first main surface and a second main surface opposite to the first main surface; conductive filler particles disposed adjacent to the first main surface; and an adhesive resin for fixing the conductive filler particles to the first main surface, wherein each conductive filler particle includes a low-melting-point metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.