Interconnect frames for SIP modules
US10638608B2 · kind B2 · utility
1Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2018 |
| Grant date | Apr 28, 2020 |
| Priority date | — |
| Expiry date | Sep 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2018
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Frames and other structures for system-in-package modules that may allow components on boards in the modules to communicate with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.