Patent · US Active

Component cooling device

US10638637B2 · kind B2 · utility

0Cited by

1References

22Claims

0Family size

Assignee

ZKW Group GmbH · AT

Inventors

Erik Edlinger · Wien, AT
Dietmar Kieslinger · Theresienfeld, AT
Emanuel WEBER · Baden, AT

Key dates

Filing date	Apr 5, 2017
Grant date	Apr 28, 2020
Priority date	—
Expiry date	Apr 5, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10257
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A component cooling device (101) comprising: a circuit board (102), the circuit board (102) having an upper side (103) and a lower side (104) facing away from the upper side (103); and at least one electronic component (106) and at least one hollow circuit board opening (107) for a gaseous cooling medium for cooling the component, wherein on the lower side (104) of the circuit board (102) is provided a guide (110) which forms a flow channel (109) that has at least one inlet (113) and at least one outlet, which is formed by the at least one circuit board opening (107), for at least one convection flow (108) of the cooling medium.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.