Chemical-mechanical processing slurry and methods
US10640680B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Apr 12, 2018 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Apr 12, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Described are chemical mechanical processing (CMP) compositions and related methods, including compositions and methods for polishing nickel-containing substrate surfaces such as nickel phosphorus (NiP) surfaces for hard disk applications, wherein the compositions contain highly irregular-shaped fused silica abrasive particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.