Multilayer frame packages for integrated circuits having a magnetic shield integrated therein, and methods therefor
US10643954B2 · kind B2 · utility
1Cited by
1References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 6, 2018 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Aug 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package may comprise a multilayer frame package including: a bottom layer; and a magnetic shield layer, including a sub-frame and a magnetic shield disposed within a periphery of the sub-frame; and an integrated circuit die provided on or above the magnetic shield layer of the multilayer frame package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.