Patent · US Active

Extended stiffener for platform miniaturization

US10643983B2 · kind B2 · utility

1Cited by

1References

9Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Eng Huat Goh · Air Itam, MY
Bok Eng Cheah · Air Itam, MY
Jackson Chung Peng Kong · Merang, MY
Min Suet Lim · Kampung Bukit Kechil, MY
Khang Choong Yong · Puchong, MY
Howe Yin Loo · Bayan Lepas, MY

Key dates

Filing date	Jun 1, 2018
Grant date	May 5, 2020
Priority date	—
Expiry date	Jun 1, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments of the present disclosure describe integrated circuit (IC) package assemblies having a stiffener that extends beyond a package substrate outer edge, computing devices incorporating the IC package assemblies, methods for formation of the IC package assemblies, and associated configurations. An IC package assembly may include a package substrate having a first side, a second side opposite the first side, and an outer edge extending between the first side and the second side; an IC die coupled with the first side of the package substrate, where the IC die includes a power terminal; a stiffener coupled with the first side of the package substrate, where the stiffener surrounds the IC die and includes a conductive routing region coupled with the IC die power terminal, and a passive electronic device coupled with the conductive routing region. Other embodiments may be described and/or claimed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.