Counterbore pocket structure for fluidic assembly
US10644190B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 1, 2018 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Jan 1, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/036
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fluidic assembly method is provided that uses a counterbore pocket structure. The method is based upon the use of a substrate with a plurality of counterbore pocket structures formed in the top surface, with each counterbore pocket structure having a through-hole to the substrate bottom surface. The method flows an ink with a plurality of objects over the substrate top surface. As noted above, the objects may be micro-objects in the shape of a disk. For example, the substrate may be a transparent substrate and the disks may be light emitting diode (LED) disks. Simultaneously, a suction pressure is created at the substrate bottom surface. In response to the suction pressure from the through-holes, the objects are drawn into the counterbore pocket structures. Also provided is a related fluidic substrate assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.