Polyphenyl ether resin composition and use thereof in high-frequency circuit substrate
US10645806B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2016 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Apr 11, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2203/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a polyphenyl ether resin composition and a use thereof in a high-frequency circuit substrate. The polyphenyl ether resin composition comprises a vinyl-modified polyphenyl ether resin and an organic silicon resin containing unsaturated double bonds and having a three-dimensional net structure. The high-frequency circuit substrate of the present invention has the advantages of a low dielectric constant, a low dielectric loss, high heat resistance, low water absorption, a high interlayer adhesive force and a high bending strength, and is very suitable as a circuit substrate of high-speed electronic equipment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.