Low-inductance current paths for on-package power distributions and methods of assembling same
US10651117B2 · kind B2 · utility
1Cited by
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18Claims
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Key dates
| Filing date | Jun 22, 2018 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | Jul 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A micro-trace containing package substrate provides a low-inductance alternating-current decoupling path between a semiconductive device and a die-side capacitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.