Method for forming superconducting structures
US10651233B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2018 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | Aug 21, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16148
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A superconducting structure includes a first superconducting device having a plurality of first superconducting contact pads disposed on a top side of a first superconducting device, a second superconducting device having a plurality of second superconducting contact pads disposed on a bottom side of a second superconducting device, and a plurality of superconducting bump structures with a given bump structure coupling respective superconducting contact pads of the plurality of first superconducting contact pads and the second plurality of superconducting pads to one another to bond the first superconducting device to the second superconducting device. Each superconducting bump structure includes a first under bump metallization (UBM) layer disposed on the top surface of a given superconducting contact pad, a second UBM layer disposed on the top surface of a given superconducting contact pads, and a superconducting metal layer coupling the first UBM layer to the second UBM layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.