JUSTIN C. HACKLEY
6Patents
1h-index
9Co-inventors
36Inventor score
Filing activity: Aug 21, 2018 → Dec 6, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10950778B2 | Superconducting bump bond electrical characterization | Electricity | 2 | Active |
| US10651233B2 | Method for forming superconducting structures | Electricity | 1 | Active |
| US11616187B2 | Superconducting bump bond electrical characterization | Electricity | 1 | Active |
| US10644218B1 | Multichip device with temperature isolating bump bonds | Electricity | 1 | Active |
| US12354988B2 | Bump structures for low temperature chip bonding | Electricity | 0 | Active |
| US12375083B2 | Superconducting phase-change material switch | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.