Bumped resonator structure
US10651361B2 · kind B2 · utility
3Cited by
37References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2019 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | Jan 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73207
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A technique relates a structure. An inductive element is on a first surface. A capacitive element is on the first surface and a second surface. An interconnect structure is between the first surface and the second surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.