Heating system and method for microfluidic and micromechanical applications
US10654714B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2016 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Sep 16, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An integrated semiconductor heating assembly includes a semiconductor substrate, a chamber formed therein, and an exit port in fluid communication with the chamber, allowing fluid to exit the chamber in response to heating the chamber. The integrated heating assembly includes a first heating element adjacent the chamber, which can generate heat above a selected threshold and bias fluid in the chamber toward the exit port. A second heating element is positioned adjacent the exit port to generate heat above a selected threshold, facilitating movement of the fluid through the exit port away from the chamber. Addition of the second heating element reduces the amount of heat emitted per heating element and minimizes thickness of a heat absorption material toward an open end of the exit port. Since such material is expensive, this reduces the manufacturing cost and retail price of the assembly while improving efficiency and longevity thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.