Temperature stabilizing enclosure
US10655896B2 · kind B2 · utility
0Cited by
0References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2016 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Mar 8, 2038 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2321/0212
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A device includes a substrate, a micro-electro-mechanical system (MEMS) device disposed on the substrate, a controller disposed on the substrate, a heating element, and an enclosure. The heating element is configured to generate heat in response to a signal generated by the controller. The enclosure encloses the MEMS sensor device, the controller, and the heating element. The controller is configured to generate the signal responsive to temperature measurements within the enclosure. The signal causes the heating element to generate heat and maintain a predetermined temperature within the enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.