Automatic inline detection and wafer disposition system and method for automatic inline detection and wafer disposition
US10656518B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2017 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Apr 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67288
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for automatic inline detection and wafer disposition includes the following steps. An exposure process is performed to wafers in an exposure apparatus. A virtual inspection is performed based on log files of the exposure process. A wafer automatic disposition is performed according to a result of the virtual inspection. An automatic inline detection and wafer disposition system includes a first computer system coupled to an exposure apparatus and a second computer system coupled to the first computer system. The exposure apparatus is configured to perform an exposure process to wafers, and the first computer system is configured to perform a virtual inspection based on log files of the exposure process. The second computer system is configured to receive a result of the virtual inspection and perform a wafer automatic disposition according to the result of the virtual inspection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.