Modeling post-lithography stochastic critical dimension variation with multi-task neural networks
US10657420B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2018 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Nov 12, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V2201/06
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of modeling distributions of post-lithography critical dimensions includes the following steps. A plurality of aerial images of respective portions of a physical design layout of a semiconductor wafer are generated, and the plurality of aerial images are employed as training data. In the method, first and second portions of a neural network architecture are generated. The first portion includes a neural network which is shared by a plurality of output channels, and the second portion includes a plurality of neural networks, wherein each of the plurality of neural networks respectively correspond to one of the plurality of output channels. The method further includes training the first and second portions of the neural network architecture with the training data, and outputting the distributions of the post-lithography critical dimensions based on the plurality of output channels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.