Heat dissipation structure, method for making the same, and electronic device having the same
US10658265B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Jun 6, 2017 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Jun 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/005
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The graphite sheet is connected to the second surface. At least one containing cavity is defined on an interface between the second surface and the graphite sheet. The heat insulating material is filled in the at least one containing cavity to form a heat insulating structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.