Cong Lei
5Patents
1h-index
5Co-inventors
33Inventor score
Filing activity: Jun 24, 2016 → Oct 8, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10448540B2 | Ultrathin heat dissipation structure | Electricity | 5 | Active |
| US10658265B2 | Heat dissipation structure, method for making the same, and electronic device having the same | Electricity | 0 | Active |
| US11380603B2 | Method for making a heat dissipation structure | Electricity | 0 | Active |
| US10923411B2 | Method for manufacturing an ultrathin heat dissipation structure | Electricity | 0 | Active |
| US10745595B2 | Resin composition, adhesive layer, and circuit board utilizing same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.