Thermoelectric cooling packages and thermal management methods thereof
US10658266B2 · kind B2 · utility
1Cited by
15References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2017 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Nov 15, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12044
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for managing a temperature of a device includes determining a temperature of a circuit or a package including the circuit, and selectively operating a thermoelectric semiconductor based on the determined temperature to adjust the temperature of the circuit or the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.