Inventor · Incheon, KR

Jae Choon Kim

34Patents
6h-index
50Co-inventors
72Inventor score

Filing activity: Nov 5, 1996 → May 2, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US5809951A Apparatus for opening and shutting valves of an engine Mechanical Engineering; Lighting; Heating 12 Expired
US9228763B2 Thermoelectric cooling packages and thermal management methods thereof Electricity 11 Active
US9606591B2 Surface temperature management method of mobile device and memory thermal management method of multichip package Physics 11 Active
US10546844B2 Stack package and method of manufacturing the stack package Electricity 9 Active
US9671141B2 Thermoelectric cooling packages and thermal management methods thereof Electricity 7 Active
US8692349B2 Semiconductor devices and methods of controlling temperature thereof Electricity 6 Active
US10198049B2 Surface temperature management method of mobile device and memory thermal management method of multichip package Physics 6 Active
US9588577B2 Electronic systems including heterogeneous multi-core processors and methods of operating same Emerging Cross-Sectional Technologies 4 Active
US9030826B2 Chip-on-film packages and device assemblies including the same Electricity 4 Active
US10347611B2 Semiconductor packages having redistribution substrate Electricity 4 Active
US9589842B2 Semiconductor package and method of fabricating the same Electricity 3 Active
US10707196B2 Electronic device and method of manufacturing the electronic device Electricity 3 Active
US9653373B2 Semiconductor package including heat spreader and method for manufacturing the same Electricity 3 Active
US9991245B2 Semiconductor packages with heat dissipation layers and pillars and methods for fabricating the same Electricity 2 Active
US10541263B2 Image sensor package having multi-level stack structure Electricity 2 Active
US10879294B2 Image sensor package having multi-level stack structure Electricity 1 Active
US11107743B2 Chip on film package and display device including the same Electricity 1 Active
US10658266B2 Thermoelectric cooling packages and thermal management methods thereof Electricity 1 Active
US9704815B2 Package substrate and semiconductor package including the same Electricity 1 Active
US11205604B2 Semiconductor package including a thermal conductive layer and method of manufacturing the same Electricity 1 Active
US10879225B2 Semiconductor package and method of manufacturing semiconductor package Electricity 1 Active
US10790213B2 Heat radiation device, semiconductor package comprising the same, and semiconductor device comprising the same Electricity 1 Active
US9651431B2 Semiconductor package and method of estimating surface temperature of semiconductor device including the same Electricity 1 Active
US10510737B2 Semiconductor package Electricity 1 Active
US12142544B2 Semiconductor package Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.