Substrate processing apparatus and substrate processing method using the same
US10662528B2 · kind B2 · utility
0Cited by
0References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2017 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Dec 12, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0228
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are a substrate processing apparatus and a substrate processing method using the same and, more particularly, a substrate processing apparatus capable of controlling deposition of a reactive-metal-containing precursor in an exhaust line, and a substrate processing method using the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.