Encapsulated circuit module, and production method therefor
US10665568B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 12, 2014 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Sep 19, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To provide a technique of preventing, in an encapsulated circuit module having a metal shield layer covering a surface of a resin layer containing filler, the shield layer from falling off.In manufacturing encapsulated circuit modules, first, a substrate 100 is covered with a first resin 400 containing filler together with an electronic component 200. Next, a surface of the first resin 400 is covered with a second resin 500 containing no filler. Subsequently, a ground electrode 110 in the substrate 100 is exposed by snicking and then a shield layer 600 that covers the entire surface of the substrate 100 is formed by electroless plating. Thereafter, snipping is performed to obtain a number of encapsulated circuit modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.