Display with embedded pixel driver chips
US10665578B2 · kind B2 · utility
17Cited by
2References
10Claims
0Family size
Inventors
Key dates
| Filing date | Feb 28, 2018 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Feb 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1426
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments describe a display integration scheme in which an array of pixel driver chips embedded front side up in an insulator layer. A front side redistribution layer (RDL) spans across and is in electrical connection with the front sides of the array of pixel driver chips, and an array of light emitting diodes (LEDs) is bonded to the front side RDL. The pixel driver chips may be located directly beneath the display area of the display panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.