Optoelectronic semiconductor component
US10665747B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2018 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Apr 26, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of producing an optoelectronic semiconductor component includes providing a carrier, arranging at least one optoelectronic semiconductor chip at a top side of the carrier, applying a phosphor layer at the at least one semiconductor chip, forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip, and removing the carrier, wherein the phosphor layer is applied before forming the shaped body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.