Inventor · Birkenfeld, DE

Karl Weidner

50Patents
9h-index
60Co-inventors
81Inventor score

Filing activity: Dec 6, 1991 → Jun 22, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US6504104B2 Flexible wiring for the transformation of a substrate with edge contacts into a ball grid array Emerging Cross-Sectional Technologies 30 Expired
US5438523A Apparatus for storing and delivering sale units Physics 26 Expired
US8723192B2 Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component Electricity 18 Active
US6685168B1 Surface acoustic wave component Emerging Cross-Sectional Technologies 14 Expired
US7402457B2 Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces Electricity 10 Expired
US7897881B2 Arrangement for hermetically sealing components, and method for the production thereof Emerging Cross-Sectional Technologies 10 Active
US5321625A Apparatus for storing and delivering sale units Physics 9 Expired
US6555758B1 Multiple blank for electronic components such as SAW components, and method of building up bumps, solder frames, spacers and the like Electricity 9 Expired
US7208347B2 Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours Electricity 9 Expired
US6256877A Method for transforming a substrate with edge contacts into a ball grid array Emerging Cross-Sectional Technologies 7 Expired
US7368324B2 Method of manufacturing self-supporting contacting structures Emerging Cross-Sectional Technologies 5 Expired
US7524775B2 Method for producing a dielectric layer for an electronic component Electricity 5 Active
US8901592B2 Optoelectronic component and method for producing it Electricity 4 Active
US9159889B2 Radiation-emitting component and method for producing radiation-emitting components Electricity 4 Active
US9653670B2 Method for producing an optoelectronic semiconductor component, and optoelectronic semiconductor component Electricity 4 Active
US9484508B2 Optoelectronic semiconductor component Electricity 4 Active
US7427532B2 Method of manufacturing a device having a contacting structure Electricity 3 Expired
US7759754B2 Economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules Emerging Cross-Sectional Technologies 3 Active
US7859005B2 Method for the production of a semiconductor component comprising a planar contact, and semiconductor component Electricity 2 Active
US9209328B2 Optoelectronic semiconductor component Electricity 2 Active
US9105771B2 Method for producing at least one optoelectronic semiconductor component Electricity 2 Active
US8513682B2 Optoelectronic component and production method for an optoelectronic component Electricity 2 Active
US9490396B2 Optoelectronic semiconductor component Electricity 2 Active
US11239170B2 Stacked modules Electricity 1 Active
US8461604B2 Optoelectronic module having a carrier substrate and a plurality of radiation-emitting semiconductor components Electricity 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.