Method of planarizing a wafer
US10668592B2 · kind B2 · utility
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18References
20Claims
0Family size
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Key dates
| Filing date | Jan 21, 2016 |
| Grant date | Jun 2, 2020 |
| Priority date | — |
| Expiry date | Jan 21, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of planarizing a wafer includes pressing the wafer against a planarization pad. The method further includes moving the planarization pad relative to the wafer. The method further includes conditioning the planarization pad using a pad conditioner. Conditioning the planarization pad includes moving the planarization pad relative to the pad conditioner. The pad conditioner includes abrasive particles having aligned tips a substantially constant distance from a surface of substrate of the pad conditioner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.