Double-membrane MEMS component and production method for a double-membrane MEMS component

US10669151B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Johann Strasser · Schierling, DE
• Alfons Dehe · Reutlingen, DE
• Gerhard Metzger-Brueckl · Geisenfeld, DE
• Juergen Wagner · Nittendorf, DE
• Arnaud Walther · Grenoble, FR

Key dates

• Filing date: Aug 30, 2018
• Grant date: Jun 2, 2020
• Expiry date: Oct 12, 2038

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B2203/0127
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A production method for a double-membrane MEMS component includes: providing a layer arrangement on a carrier substrate, wherein the layer arrangement comprises a first membrane structure, a sacrificial material layer adjoining the first membrane structure, and a counterelectrode structure in the sacrificial material layer and at a distance from the first membrane structure, wherein at least one through opening is formed in the sacrificial material layer as far as the first membrane structure; forming a filling material structure in the at least one through opening by applying a first filling material layer on the wall region of the at least one through opening; applying a second membrane structure on the layer arrangement with the sacrificial material; and removing the sacrificial material from an intermediate region to expose the filling material structure in the intermediate region.