Patent · US Active

Probe card and wafer testing system and wafer testing method

US10670654B2 · kind B2 · utility

2Cited by

12References

20Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Yuan-Chun Wu · Daxi District, TW
Chang Xu · Shanghai, CN
Ni SHEN · Shanghai, CN

Key dates

Filing date	Mar 1, 2016
Grant date	Jun 2, 2020
Priority date	—
Expiry date	Mar 1, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/34
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A probe card, a wafer testing system and a wafer testing method are provided. The wafer testing system includes a wafer holder and a probe card. A wafer is held on the wafer holder, and testing pads are formed on the wafer, in which the testing pads are arranged along a test straight line. The probe card includes probes each of which includes an arm portion and a tip portion. An included angle between the test straight line and an extension of a projection line of the arm portion onto the wafer ranges from about 40 degrees to about 55 degrees.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.