Leadframe having organic, polymerizable photo-imageable adhesion layer
US10672692B2 · kind B2 · utility
0Cited by
3References
30Claims
0Family size
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Key dates
| Filing date | Nov 21, 2017 |
| Grant date | Jun 2, 2020 |
| Priority date | — |
| Expiry date | Nov 21, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame that is partially covered with an adhesion layer. A method for forming a lead frame with an adhesion layer starting with a lead frame and using a photo-imageable polyimide or epoxy material to form the adhesion layer. A method for forming a lead frame with an adhesion layer starting with a lead frame blank and using a photo-imageable polyimide or epoxy material to form the adhesion layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.