Vertical transmon qubit device with microstrip waveguides
US10672971B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2018 |
| Grant date | Jun 2, 2020 |
| Priority date | — |
| Expiry date | Mar 23, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D48/383
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Techniques for a vertical Josephson junction superconducting device using microstrip waveguides are provided. In one embodiment, a chip surface base device structure is provided that comprises a superconducting material located on a first side of a substrate, and a second superconducting material located on a second side of the substrate and stacked on a second substrate, wherein the first side of the substrate and the second side of the substrate are opposite sides. In one implementation, the substrate or the second substrate, or the substrate and the second substrate are crystalline silicon. In one implementation, the chip surface base device structure also comprises a transmon qubit comprising a capacitor and a Josephson junction formed in a via of the substrate and comprising a tunnel barrier. In one implementation, the chip surface base device structure also comprises a microstrip line electrically coupled to the transmon qubit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.