MEMS component and production method for a MEMS component

US10676346B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Arnaud Walther · Grenoble, FR
• Alfons Dehe · Reutlingen, DE
• Gerhard Metzger-Brueckl · Geisenfeld, DE
• Johann Strasser · Schierling, DE

Key dates

• Filing date: Sep 20, 2018
• Grant date: Jun 9, 2020
• Expiry date: Oct 13, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H04R2201/003
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A production method for a MEMS component includes providing a layer arrangement on a carrier substrate, where the layer arrangement includes a first and second layer structure. A sacrificial material is arranged in an intermediate region between the first and second layer structures, an etch stop structure extending between the first and second layer structures subdivides the intermediate region into an exposure region and an edge region laterally adjoining the exposure region, and at least one of the first layer structure or the second layer structure has access openings to the exposure region. The method further includes removing the sacrificial material from the exposure region through the access openings using an etching process to expose the exposure region. The etch stop structure provides a lateral delimitation for the etching process, and the sacrificial material present in the edge region provides a mechanical connection between the first and second layer structures.