Memory extensible chip
US10678738B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2019 |
| Grant date | Jun 9, 2020 |
| Priority date | — |
| Expiry date | Mar 27, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2213/0038
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A memory extensible chip (200) is provided. The chip (200) includes a substrate (240), and a processor (230), a first memory module set (210), and a second memory module set (220) that are integrated on the substrate (240). The processor (230) communicates with at least one memory module in the first memory module set (210) using a first communications interface (250), and the processor (230) communicates with at least one memory module in the second memory module set (220) using a second communications interface (260). A memory module in the first memory module set (210) communicates with a memory module in the second memory module set (220) using a substrate network, where the substrate network is a communications network located inside the substrate (240). In this way, the processor (230) can access a memory module in the first memory module set (210) by using the second memory module set (220).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.