Fen Dai
8Patents
5h-index
21Co-inventors
63Inventor score
Filing activity: Dec 16, 1998 → Dec 13, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6561889B1 | Methods for making reinforced wafer polishing pads and apparatuses implementing the same | Performing Operations; Transporting | 39 | Expired |
| US6572463B1 | Methods for making reinforced wafer polishing pads utilizing direct casting and apparatuses implementing the same | Performing Operations; Transporting | 38 | Expired |
| US6261158A | Multi-step chemical mechanical polishing | Electricity | 25 | Expired |
| US10678738B2 | Memory extensible chip | Physics | 18 | Active |
| US6949020B2 | Methods for making reinforced wafer polishing pads and apparatuses implementing the same | Performing Operations; Transporting | 8 | Expired |
| US10069947B2 | Method and apparatus for processing data packet based on parallel protocol stack instances | Electricity | 2 | Active |
| US9497035B2 | Method, device, and system for playing media based on P2P | Electricity | 2 | Active |
| US11264249B2 | Carbon containing hardmask removal process using sulfur containing process gas | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.