Semiconductor device

US10679959B2 · kind B2 · utility

Assignee

• Intel Deutschland GmbH · DE

Inventors

• Christoph Kutter · Munich, DE
• Ewald Soutschek · Haar, DE
• Georg Meyer-Berg · Birkenfeld, DE

Key dates

• Filing date: Dec 14, 2018
• Grant date: Jun 9, 2020
• Expiry date: Dec 14, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19104
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor device including a semiconductor chip having a first conduction element; a substrate having second and third conduction elements; and external connection elements configured to form an electrical path between the second and third conduction elements via the first conduction element.