Inventor · Birkenfeld, DE

Georg Meyer-Berg

63Patents
6h-index
50Co-inventors
75Inventor score

Filing activity: Jul 3, 2000 → Jun 30, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US6359790B1 Multichip module having a silicon carrier substrate Electricity 63 Expired
US8183677B2 Device including a semiconductor chip Electricity 18 Active
US7176131B2 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same Electricity 12 Expired
US9190389B2 Chip package with passives Electricity 12 Active
US8648456B1 Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package Electricity 11 Active
US7317251B2 Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components Electricity 9 Expired
US8124953B2 Sensor device having a porous structure element Electricity 6 Active
US8513771B2 Semiconductor package with integrated inductor Electricity 5 Active
US8373240B2 Sensor device having a structure element Electricity 4 Active
US7256493B2 Ball grid array housing having a cooling foil Electricity 4 Expired
US11195787B2 Semiconductor device including an antenna Electricity 4 Active
US10211158B2 Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module Electricity 3 Active
US9171787B2 Packaged semiconductor device having an embedded system Electricity 3 Active
US7176059B2 Method of fabricating an electronic component having at least one semiconductor chip on a circuit carrier with elastic external contacts Emerging Cross-Sectional Technologies 3 Expired
US10679959B2 Semiconductor device Electricity 3 Active
US7129570B2 Electronic component having at least one semiconductor chip on a circuit carrier and method for producing the same Emerging Cross-Sectional Technologies 3 Expired
US9349709B2 Electronic component with sheet-like redistribution structure Electricity 3 Active
US9627305B2 Semiconductor module with interlocked connection Electricity 2 Active
US7498674B2 Semiconductor module having a coupling substrate, and methods for its production Electricity 2 Active
US8124449B2 Device including a semiconductor chip and metal foils Electricity 2 Active
US9425116B2 Integrated circuit package and a method for manufacturing an integrated circuit package Electricity 1 Active
US8652866B2 Sensor device and method Electricity 1 Active
US10049962B2 Arrangement of multiple power semiconductor chips and method of manufacturing the same Electricity 1 Active
US11233027B2 Semiconductor device Electricity 1 Active
US8580612B2 Chip assembly Electricity 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.