Cooling electronic devices in a data center
US10681846B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2018 |
| Grant date | Jun 9, 2020 |
| Priority date | — |
| Expiry date | Apr 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20636
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.